有很多其他稱呼，包括FR-4光板，F(xiàn)R-4纖維板，F(xiàn)R-4環(huán)氧樹脂板，F(xiàn)R-4阻燃絕緣板，這么多的稱呼也從側(cè)面反映了FR-4玻纖板廣泛的應(yīng)用。FR-4玻纖板一般用于軟包基層，外面再包布藝、皮革等，做成美觀的墻面、吊頂裝飾。應(yīng)用非常廣泛。具有吸音，隔聲，隔熱，環(huán)保，阻燃等特點(diǎn)。下面是關(guān)于FR-4玻纖板具體的性能特點(diǎn)分析：FR-4環(huán)氧玻纖布，是以環(huán)氧樹脂作粘合劑，以電子級(jí)玻璃纖維布作增強(qiáng)材料的一類基板。它的粘結(jié)片和內(nèi)芯薄型覆銅板，是制作多層印制電路板的重要基材。

 

There are many other names, including FR-4 light sheet, FR-4 fiber sheet, FR-4 epoxy sheet, FR-4 flame retardant sheet, so many names also reflect the wide application of FR-4 fiberglass sheet from other side. . FR-4 fiberglass sheet is generally used for soft-packing base layer, and then wrapped with fabric, leather, etc., to make beautiful wall and ceiling decoration. The application is very extensive. With sound absorption, sound insulation, heat insulation, environmental protection, flame retardant and so on. The following is a detailed analysis of the performance characteristics of FR-4 glass fiberglass sheet: FR-4 epoxy fiberglass cloth, which is a kind of substrate with epoxy resin as binder and electronic grade glass fiber cloth as reinforcing material. Its bonding sheet and inner core thin copper clad plate are important substrates for making multilayer printed circuit boards.

 

性能：環(huán)氧玻纖布基板的機(jī)械性能、尺寸穩(wěn)定性、抗沖擊性、耐濕性能比紙基板高。它的電氣性能優(yōu)良，工作溫度較高，本身性能受環(huán)境影響小。在加工工藝上，要比其他樹脂的玻纖布基板具有很大的優(yōu)越性。這類產(chǎn)品主要用于雙面PCB ，用量很大。電絕緣性能穩(wěn)定、平整度好、表面光滑、無(wú)凹坑、厚度公差標(biāo)準(zhǔn)，適合應(yīng)用于高性能電子絕緣要求的產(chǎn)品，如FPC補(bǔ)強(qiáng)板、PCB鉆孔墊板、玻纖介子、電位器碳膜印刷玻璃纖維板、精密游星齒輪(晶片研磨）、精密測(cè)試板材.氣（電器）設(shè)備絕緣撐條隔板、絕緣墊板、變壓器絕緣板、電機(jī)絕緣件、研磨齒輪、電子開關(guān)絕緣板等。

 

Performance: The mechanical properties, dimensional stability, impact resistance and moisture resistance of the epoxy fiberglass substrate are higher than those of the paper substrate. Its electrical performance is excellent, its operating temperature is high, and its performance is less affected by the environment. In terms of processing technology, it has great advantages over other resin fiberglass cloth substrates. These products are mainly used for double-sided PCBs and are used in large quantities. Stable electrical insulation performance, good flatness, smooth surface, no pits, thickness tolerance standards, suitable for high performance electronic insulation requirements, such as FPC reinforcement board, PCB drilling pad, glass fiber meson, potentiometer carbon Film printing fiberglass board, precision star gear (wafer grinding), precision test board, gas (electrical) equipment insulation struts, insulation pads, transformer insulation board, motor insulation parts, grinding gears, electronic switch insulation boards, etc.

 

FR-4環(huán)氧玻璃布層壓板產(chǎn)品表面準(zhǔn)備與處理

 

Surface preparation and treatment of FR-4 epoxy glass cloth laminate

 

1. 銅面經(jīng)過(guò)圖形和蝕刻形成電路之后，盡量要減少對(duì)PTFE表面的處理和接觸。操作員應(yīng)配戴干凈手套并且在每片板子放隔層膠片以便傳遞到下一程序。

 

1. After the copper surface is patterned and etched to form a circuit, try to reduce the handling and contact of the PTFE surface. The operator should wear clean gloves and place a film on each board for transfer to the next procedure.

 

2. 經(jīng)蝕刻過(guò)后的PTFE表面具備足夠粗糙度進(jìn)行粘合。在蝕刻過(guò)薄片的地方或者未覆蓋層壓板將被粘合的地方，建議對(duì)PTFE表面進(jìn)行處理以提供足夠的依附。在pth準(zhǔn)備過(guò)程中所使用的化學(xué)成分也能用于表面處理。推薦等離子蝕刻或含鈉的化學(xué)試劑。

 

2. The etched PTFE surface has sufficient roughness for bonding. Where the lamella is etched or where the laminate is not covered, it is recommended that the PTFE surface be treated to provide adequate attachment. The chemical components used in the pth preparation process can also be used for surface treatment. Plasma etching or sodium containing chemicals are recommended.

 

3. 銅表面處理應(yīng)保證最佳粘合強(qiáng)度。棕色的一氧化銅電路處理將加強(qiáng)表面形狀以便于使用TacBond粘合劑進(jìn)行化學(xué)粘合。第一個(gè)過(guò)程要求一名清潔員去除殘余和處理用油。 接下來(lái)進(jìn)行細(xì)微的銅蝕刻以形成一個(gè)統(tǒng)一的粗糙表面區(qū)域。棕色的氧化物針狀晶體在層壓過(guò)程中穩(wěn)固了粘合層。同任何化學(xué)過(guò)程一樣，每一步進(jìn)程后的充分清洗都是必需的。鹽殘余會(huì)抑制粘合。最后的沖洗應(yīng)實(shí)行監(jiān)督并保持PH值小于8.5。逐層干燥并確保表面不被手上的油之類的污染。

 

3. Copper surface treatment should ensure optimum bond strength. The brown copper oxide circuit treatment will reinforce the surface shape for chemical bonding using TacBond adhesive. The first process requires a cleaner to remove residual and processing oil. A fine copper etch is then performed to form a uniform rough surface area. The brown oxide needle crystals stabilize the adhesive layer during lamination. As with any chemical process, adequate cleaning after each step is required. Salt residue will inhibit adhesion. The final rinse should be supervised and maintained at a pH of less than 8.5. Dry layer by layer and ensure that the surface is not contaminated by oil on your hands.

 

疊加與層壓

 

Overlay and lamination

 

推薦粘合（壓合或壓板）溫度：425℉（220℃）

 

Recommended bonding (press or plate) temperature: 425 ° F (220 ° C)

 

1. 250oF(100℃)烘烤板層以消除水分。板層儲(chǔ)存在緊密控制的環(huán)境中并在24小時(shí)之內(nèi)使用。

 

1. Bake the plate at 250oF (100 ° C) to remove moisture. The plies are stored in a tightly controlled environment and used within 24 hours.

 

2. 工具板與第一個(gè)電解板之間應(yīng)使用壓力場(chǎng)以使得控制板中的壓力能平均分配。存在于板中以及將被填充的電路板中的高壓區(qū)域?qū)⒈粓?chǎng)吸收。場(chǎng)也能使從外部到中心的溫度統(tǒng)一起來(lái)。從而形成控制板與控制板之間的厚度統(tǒng)一。

 

2. A pressure field should be used between the tool plate and the first plate to distribute the pressure in the control panel evenly. The high voltage regions present in the board and in the board to be filled will be absorbed by the field. The field also unifies the temperature from the outside to the center. Thereby forming a uniform thickness between the control board and the control board.

 

3. 板必須由供應(yīng)商提供的TAC BOND薄層組成。在切割薄層與疊加的時(shí)候要小心防止污染。根據(jù)電路設(shè)計(jì)及填充要求，1至3張粘合薄層是必需的。需要填充的區(qū)域以及介電要求都被用于計(jì)算0.0015"(38微米)薄板的需求。推薦在層壓板之間使用干凈精鋼制或鋁制鏡板。

 

3. The board must consist of a thin layer of TAC BOND supplied by the supplier. Be careful to prevent contamination when cutting thin layers and stacking. Depending on the circuit design and filling requirements, 1 to 3 bonded layers are required. The areas that need to be filled and the dielectric requirements are used to calculate the 0.0015" (38 micron) sheet. It is recommended to use clean steel or aluminum mirror plates between the laminates.

 

4. 為協(xié)助層壓，在加熱前進(jìn)行20分鐘的真空處理。整個(gè)周期都保持真空狀態(tài)。抽離空氣將有助于確保完成電路的封裝。

 

4. To assist in lamination, vacuum treatment is carried out for 20 minutes before heating. The vacuum is maintained throughout the cycle. Pumping away from the air will help ensure that the circuit is packaged.

 

5.在中心板的外圍區(qū)域放置熱電偶就能確定溫度監(jiān)測(cè)與適當(dāng)?shù)闹芷凇?/div>